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https://arstechnica.com/tech-policy/2023/11/new-chip-packaging-facility-could-save-tsmcs-arizona-fab-from-paperweight-status/
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New chip-packaging facility could save TSMC’s Arizona fab from “paperweight” status - Ars Technica
11/30/23 at 7:25pm
Organization
Ars Technica
Author
Andrew Cunningham
Details
28 words
Summarize
Business & Industrial
Packaging
chip-packaging facility
Taiwan Semiconductor Manufacturing Co.
iPhone Designers Develop Special Face Masks Apple Inc.
AZ
packaging facility
Ars Technica
Apple will be "first and largest customer" at new $2 billion packaging facility.
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